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Produktinformation
Produktöversikt
ON Semiconductor’s range of C-Series, SMT (surface mount technology) SiPM sensors have been used to create compact and scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space. The ArrayC products are available in a variety of formats, and formed of pixels of different sizes. The back of each ArrayC has either one or more multi-way connectors, or a BGA (ball grid array), that allow access to the fast output and standard I/O from each pixel in the array, and a common I/O from the summed substrates of the pixels. The ArrayC products with connectors can be used to interface with the user’s own readout via the mating connector, or to ON Semiconductor’s Breakout Boards (BOBs). The BOBs allow for easy access to the pixel signals and performance evaluation of the arrays.
- 35 um (18,980 microcells)
- I/O Interface - Connector
- Array Size 8x8
- Pixel Pitch 7.2 mm
Varningar
Market demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.
Tekniska specifikationer
C-Series SiPM Sensor
18980Microcells
Module
Module
No SVHC (15-Jan-2018)
8mm x 8mm
35µm
420nm
160Pins
Teknisk dokumentation (1)
Tillhörande produkter
2 produkter hittades
Lagstiftning och miljö
Det land där den sista betydelsefulla tillverkningsprocessen utfördesUrsprungsland:Thailand
Det land där den sista betydelsefulla tillverkningsprocessen utfördes
RoHS
RoHS
Certifikat för produktefterlevnad