ADTF3175BMLZ

ADTF3175BMLZ is a complete time-of-flight (ToF) module for high-resolution 3D depth sensing and vision systems. Based on the ADSD3100, a 1-megapixel CMOS indirect ToF (iToF) imager, the ADTF3175 also integrates the lens and optical band-pass filter for the imager, an infrared illumination source containing optics, laser diode, laser diode driver, and photodetector, a flash memory, and power regulators to generate local supply voltages. The module is fully calibrated at multiple range and resolution modes. To complete the depth sensing system, the raw image data from the device is processed externally by the host system processor or depth image signal processor (ISP). Applications include machine vision systems, robotics, building automation, augmented reality (AR) systems. Applications include machine vision systems, robotics, building automation, and augmented reality (AR) systems.

• 1024 × 1024 ToF imager with 3.5µm × 3.5µm pixels, 75° × 75° field of view
• Imager lens subassembly with 940nm band-pass filter
• 4-lane MIPI CSI-2 transmitter interface, 1.5Gbps per lane
• 4-wire SPI and 2-wire I²C serial interfaces, NVM (flash) for module boot-up sequence
• Power regulators for local imager and illumination rails
• Calibrated modes at 1024 × 1024 and 512 × 512 resolutions
• Depth accuracy is ±5mm (across full depth range)
• Operating temperature range of -20°C to 65°C

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