BGA-STD-050
Heat Sink, For Ball Grid Array, Standard, 14 °C/W, BGA, 20 mm, 19.1 mm, 20 mm
Behöver du fler?
| Antal | |
|---|---|
| 1+ | 40,030 kr |
| 10+ | 27,520 kr |
| 25+ | 25,780 kr |
| 50+ | 24,150 kr |
| 100+ | 19,910 kr |
Produktinformation
Produktöversikt
The BGA-STD-050 is a 20mm standard Heat Sink with aluminium, black anodized, thermal tape, 14°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- 0.27mm Thickness
Tillämpningar
HVAC
Tekniska specifikationer
14°C/W
20mm
20mm
Aluminium
0.752"
-
No SVHC (17-Jan-2023)
BGA
19.1mm
-
0.79"
0.79"
-
Teknisk dokumentation (1)
Lagstiftning och miljö
Det land där den sista betydelsefulla tillverkningsprocessen utfördesUrsprungsland:Great Britain
Det land där den sista betydelsefulla tillverkningsprocessen utfördes
RoHS
RoHS
Certifikat för produktefterlevnad