BGA-STD-015
Heat Sink, For Ball Grid Array, Standard, 26.5 °C/W, BGA, 14 mm, 10 mm, 14 mm
Behöver du fler?
| Antal | |
|---|---|
| 1+ | 32,380 kr |
| 10+ | 24,610 kr |
| 25+ | 19,750 kr |
| 50+ | 18,560 kr |
| 100+ | 18,240 kr |
Produktinformation
Produktöversikt
The BGA-STD-015 is a 14mm standard Heat Sink with aluminium, black anodized, thermal tape, 26.5°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- 0.27mm Thickness
Tillämpningar
HVAC
Tekniska specifikationer
26.5°C/W
14mm
14mm
Aluminium
0.39"
-
BGA
10mm
-
0.55"
0.55"
-
Teknisk dokumentation (1)
Lagstiftning och miljö
Det land där den sista betydelsefulla tillverkningsprocessen utfördesUrsprungsland:Great Britain
Det land där den sista betydelsefulla tillverkningsprocessen utfördes
RoHS
RoHS
Certifikat för produktefterlevnad