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Solder Wire, Lead Free, 0.7mm Diameter, 227°C, 500g, Alloy 99.3, 0.7 Sn, Cu

MULTICOMP 507-1422

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Manufacturer Part No:
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Product Range
Multicomp Type 400 Solder Wire
Technical Datasheet:
507-1422   Datasheet
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Product Range Selector (Multicomp Type 400 Solder Wire)

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Product Information

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Lead Free

No Clean and Rosin Flux

99.3, 0.7 Sn, Cu






Multicomp Type 400 Solder Wire

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Technical Documents (2)

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CAD Models - Notice
CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
Use of these CAD models and other options provided are downloaded and used entirely at your own risk and by continuing you confirm acceptance of the above.

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Product Overview

Multicomp Typ 400 solder wires have been specially formulated to complement No Clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. This is designed for users who require a halide free formulation. Multicomp solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of fluxes means they are also well suited to soldering applications requiring high melting temperature alloys.
  • Solder wire applicable at repair operations
  • Designed for users who require a halide free formulation
  • Formulated to complement no clean wave and reflow soldering processes
  • Multicomp products are rated 4.6 out of 5 stars
  • 12-month limited warranty *view Terms & Conditions for details
  • 96% of customers would recommend to a friend


Maintenance & Repair, Industrial, Communications & Networking, Audio


Lead Free. Material Composition: 99.3% Tin, 0.7% Copper. Rosin based flux, halide activated, normal activation level
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More stock available week commencing 6/26/23
Standard lead time for this product is 12 weeks.

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