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ManufacturerALLIANCE MEMORY
Manufacturer Part NoAS4C1G16D4-062BCN
Order Code4260993
Technical Datasheet
1,115 In Stock
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| Quantity | Price (ex VAT) |
|---|---|
| 1+ | kr253.680 |
| 10+ | kr234.970 |
| 25+ | kr227.460 |
| 50+ | kr204.080 |
| 100+ | kr194.390 |
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Product Information
ManufacturerALLIANCE MEMORY
Manufacturer Part NoAS4C1G16D4-062BCN
Order Code4260993
Technical Datasheet
DRAM TypeDDR4
Memory Density16Gbit
Memory Configuration1G x 16bit
Clock Frequency Max1.6GHz
IC Case / PackageFBGA
No. of Pins96Pins
Supply Voltage Nom1.2V
IC MountingSurface Mount
Operating Temperature Min0°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (27-Jun-2024)
Product Overview
AS4C1G16D4-062BCN DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as an eight-bank DRAM for the x16 configuration. The DDR4 SDRAM uses an 8n-prefetch architecture to achieve high-speed operation. The 8n-prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single READ or WRITE operation for the DDR4 SDRAM consists of a single 8n-bit wide, four-clock data transfer at the internal DRAM core and two corresponding n-bit wide, one-half-clock-cycle data transfers at the I/O pins.
- On-die, internal, adjustable VREFDQ generation, VDD = VDDQ = 1.2V ±60mV
- 1.2V pseudo open-drain I/O, 8 internal banks (x16): 2 groups of 4 banks each
- 8n-bit prefetch architecture, programmable data strobe preambles
- Data strobe preamble training, command/address latency (CAL), command/address (CA) parity
- Multipurpose register READ and WRITE capability, write levelling, self refresh mode
- Low-power auto self-refresh (LPASR), temperature-controlled refresh (TCR)
- Fine granularity refresh, self refresh abort, maximum power saving, output driver calibration
- Nominal, park, and dynamic on-die termination (ODT), data bus inversion (DBI) for data bus
- Databus write cyclic redundancy check (CRC), Per-DRAM addressability, JEDEC JESD-79-4 compliant
- 96-ball FBGA package, commercial temperature range from 0°C to 95°C
Technical Specifications
DRAM Type
DDR4
Memory Configuration
1G x 16bit
IC Case / Package
FBGA
Supply Voltage Nom
1.2V
Operating Temperature Min
0°C
Product Range
-
Memory Density
16Gbit
Clock Frequency Max
1.6GHz
No. of Pins
96Pins
IC Mounting
Surface Mount
Operating Temperature Max
95°C
SVHC
No SVHC (27-Jun-2024)
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
Tariff No:85423231
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:To be advised
SVHC:No SVHC (27-Jun-2024)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.000001